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TC1426/TC1427/TC1428
1.2A Dual High-Speed MOSFET Drivers
Features:
* Low Cost * Latch-Up Protected: Will Withstand 500 mA Reverse Output Current * ESD Protected 2kV * High Peak Output Current: 1.2A * Wide Operating Range: - 4.5V to 16V * High Capacitive Load Drive Capability: 1000 pF in 38 nsec * Low Delay Time: 75 nsec Max * Logic Input Threshold Independent of Supply Voltage * Output Voltage Swing to Within 25 mV of Ground or VDD * Low Output Impedance: 8
Package Type
8-Pin PDIP/SOIC
NC 1 IN A 2 GND 3 IN B 4 2, 4 7, 5 TC1426CPA 8 NC 7 OUT A 6 VDD NC 1 IN A 2 GND 3 TC1427CPA 8 NC 7 OUT A 6 VDD NC 1 IN A 2 GND 3 TC1428CPA 8 NC 7 OUT A 6 VDD 5 OUT B 2 7
5 OUT B IN B 4 2, 4 7, 5
5 OUT B IN B 4
Inverting
Noninverting 4 5
NC 1 IN A 2 GND 3 IN B 4 2, 4 7, 5 TC1426COA
8 NC 7 OUT A 6 VDD
NC 1 IN A 2 GND 3 TC1427COA
8 NC 7 OUT A 6 VDD
NC 1 IN A 2 GND 3 TC1428COA
8 NC 7 OUT A 6 VDD 5 OUT B 2 7
5 OUT B IN B 4 2, 4 7, 5
5 OUT B IN B 4
Inverting NC = No connection
Noninverting 4 5
General Description:
The TC1426/TC1427/TC1428 are a family of 1.2A dual high-speed drivers. CMOS fabrication is used for lowpower consumption and high efficiency. These devices are fabricated using an epitaxial layer to effectively short out the intrinsic parasitic transistor responsible for CMOS latch-up. They incorporate a number of other design and process refinements to increase their long-term reliability. The TC1426 is compatible with the bipolar DS0026, but only draws 1/5 of the quiescent current. The TC1426/ TC1427/TC1428 are also compatible with the TC426/ TC427/TC428, but with 1.2A peak output current rather than the 1.5A of the TC426/TC427/TC428 devices. Other compatible drivers are the TC4426/TC4427/ TC4428 and the TC4426A/TC4427A/TC4428A. The TC4426/TC4427/TC4428 have the added feature that the inputs can withstand negative voltage up to 5V with diode protection circuits. The TC4426A/TC4427A/ TC4428A have matched input to output leading edge and falling edge delays, tD1 and tD2, for processing short duration pulses in the 25 nanoseconds range. All of the above drivers are pin compatible. The high-input impedance TC1426/TC1427/TC1428 drivers are CMOS/TTL input-compatible, do not require the speed-up needed by the bipolar devices, and can be directly driven by most PWM ICs. This family of devices is available in inverting and noninverting versions. Specifications have been optimized to achieve low-cost and high-performance devices, well-suited for the high-volume manufacturer.
Applications:
* * * * * Power MOSFET Drivers Switched Mode Power Supplies Pulse Transformer Drive Small Motor Controls Print Head Drive
Device Selection Table
Part Number TC1426COA TC1426CPA TC1427COA TC1427CPA TC1428COA TC1428CPA Package 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP 8-Pin SOIC 8-Pin PDIP Temp. Range 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C 0C to +70C
(c) 2006 Microchip Technology Inc.
DS21393C-page 1
TC1426/TC1427/TC1428
Functional Block Diagram
V+ 500 A 2.5 A TC1426 Inverting TC1427 Noninverting TC1428 Inverting/Noninverting Noninverting Output (TC1427) Input Inverting Output (TC1426)
GND NOTE: TC1428 has one inverting and one noninverting driver. Ground any unused driver input.
DS21393C-page 2
(c) 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ..................................................... +18V Input Voltage, Any Terminal ................................... VDD + 0.3V to GND - 0.3V Power Dissipation (TA 70C) PDIP........................................................ 730 mW SOIC ....................................................... 470 mW Derating Factor PDIP....................................................... 8 mW/C SOIC ...................................................... 4 mW/C Operating Temperature Range C Version ........................................ 0C to +70C Storage Temperature Range.............. -65C to +150C
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25C, with 4.5V VDD 16V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL RO IPK IREV High Output Voltage Low Output Voltage Output Resistance Peak Output Current Latch-Up Current Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current
1: Switching times ensured by design.
Parameter
Min
Typ
Max
Units
Test Conditions
Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current
3 -- -1 VDD - 0.025 -- -- -- -- --
-- -- -- -- -- 12 8 1.2 >500
-- 0.8 1 -- 0.025 18 12 -- --
V V A V V A mA 0V VIN VDD Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 IOUT = 10 mA, VDD = 16V
Switching Time (Note 1) tR tF tD1 tD2 IS
Note
-- -- -- -- -- --
-- -- -- -- -- --
35 25 75 75 9 0.5
nsec nsec nsec nsec mA
Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 VIN = 3V (Both Inputs) VIN = 0V (Both Inputs)
Power Supply
(c) 2006 Microchip Technology Inc.
DS21393C-page 3
TC1426/TC1427/TC1428
TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD 16V, unless otherwise noted. Symbol Input VIH VIL IIN Output VOH VOL RO IREV High Output Voltage Low Output Voltage Output Resistance Latch-Up Current Withstand Reverse Current Rise Time Fall Time Delay Time Delay Time Power Supply Current
1: Switching times ensured by design.
Parameter
Min
Typ
Max
Units
Test Conditions
Logic 1, High Input Voltage Logic 0, Low Input Voltage Input Current
3 -- -10 VDD - 0.025 -- -- -- --
-- -- -- -- -- 15 10 >500
-- 0.8 10 -- 0.025 23 18 --
V V A V V mA 0V VIN VDD Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 IOUT = 10 mA, VDD = 16V
Switching Time (Note 1) tR tF tD1 tD2 IS
Note
-- -- -- -- -- --
-- -- -- -- -- --
60 40 125 125 13 0.7
nsec nsec nsec nsec mA
Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 Figure 3-1, Figure 3-2 VIN = 3V (Both Inputs) VIN = 0V (Both Inputs)
Power Supply
DS21393C-page 4
(c) 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (8-Pin PDIP, SOIC) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Symbol NC IN A GND IN B OUT B VDD OUT A NC No connection. Control input A, TTL/CMOS compatible logic input. Ground. Control input B, TTL/CMOS compatible logic input. Output B, CMOS totem-pole output. Supply input, 4.5V to 16V. Output A, CMOS totem-pole output. No connection. Description
(c) 2006 Microchip Technology Inc.
DS21393C-page 5
TC1426/TC1427/TC1428
3.0
3.1
APPLICATIONS INFORMATION
SUPPLY BYPASSING
3.3
INPUT STAGE
Large currents are required to charge and discharge capacitive loads quickly. For example, charging a 1000 pF load to 16V in 25 nsec requires a 0.8A current from the device's power supply. To ensure low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low-inductance ceramic MLC capacitors with short lead lengths (<0.5-in.) should be used. A 1.0 F film capacitor in parallel with one or two 0.1 F ceramic MLC capacitors normally provides adequate bypassing.
The input voltage level changes the no-load or quiescent supply current. The N-channel MOSFET input stage transistor drives a 2.5 mA current source load. With a logic `1' input, the maximum quiescent supply current is 9 mA. Logic `0' input level signals reduce quiescent current to 500 A maximum. Unused driver inputs must be connected to VDD or GND. Minimum power dissipation occurs for logic `0' inputs for the TC1426/TC1427/TC1428. The drivers are designed with 100 mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresholds are approximately 1.5V, making a logic `1' input any voltage greater than 1.5V up to VDD. Input current is less than 1 A over this range. The TC1426/TC1427/TC1428 may be directly driven by the TL494, SG1526/27, TC38C42, TC170 and similar switch-mode power supply integrated circuits.
3.2
GROUNDING
The TC1426 and TC1428 contain inverting drivers. Individual ground returns for the input and output circuits or a ground plane should be used. This will reduce negative feedback that causes degradation in switching speed characteristics.
Test Circuit
VDD = 16V 1 F WIMA MKS-2
Test Circuit
VDD = 16V 1 F WIMA MKS-2 Input 1
0.1 F MLC
0.1 F MLC
Output CL = 1000 pF
Input
1
Output CL = 1000 pF
2
2
TC1426 (1/2 TC1428)
TC1427 (1/2 TC1428)
+5V Input 0V VDD Output 0V 10% 10% tD1 90% tF
+5V
90%
Input 0V 10% 90% tR 10%
90%
tD2
VDD
tR 90%
Output 0V
tD1
tD2
90% tF 10%
10%
FIGURE 3-1: Time
Inverting Driver Switching
FIGURE 3-2: Switching Time
Noninverting Driver
DS21393C-page 6
(c) 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Rise Time vs. Supply Voltage
550 440
TA = +25C
Fall Time vs. Supply Voltage
330
TA = +25C
Delay Time vs. Supply Voltage
80
CL = 1000 pF TA = +25C
264
70
TIME (nsec)
TIME (nsec)
330
10,000 pF
198
TIME (nsec)
10,000 pF
60
220 4700 pF 110 2200 pF
132 4700 pF 66 2200 pF
50
tD1
40
tD2
0 5 7 9 11 VDD (V) 13 15
0
5
7
9 11 VDD (V)
13
15
30
5
7
11 9 VDD (V)
13
15
Rise and Fall Times vs. Temperature
40
CL = 1000 pF VDD = +15V tRISE
Delay Time vs. Temperature
60
CL = 1000 pF VDD = +15V
Supply Current vs. Capacitive Load
30
CL = 1000 pF VDD = +15V TA = +25C
SUPPLY CURRENT (mA)
32
54
500 kHz
24
TIME (nsec)
24
TIME (nsec)
tFALL
48
tD2
18
200 kHz
16
42
tD1
12
20 kHz
8
36
6 0
0 25
0 45 65 85 105 TEMPERATURE (C) 125 25 45 65 85 105 TEMPERATURE (C) 125
100
520 940 1360 1780 CAPACITIVE LOAD (pF)
2200
Rise Time vs. Capacitive Load
1000
TA = +25C
Fall Time vs. Capacitive Load
1000
TA = +25C
Supply Current vs. Frequency
100
CL = 1000 pF TA = +25C VDD = 15V VDD = 10V
SUPPLY CURRENT (mA)
80
TIME (nsec)
TIME (nsec)
5 VDD
100
10 VDD
100 10 VDD
5 VDD
60
40
15 VDD
15VDD 10 100
20 VDD = 5V 0 10
10 100
1000 CAPACITIVE LOAD (pF)
10,000
10,000 1000 CAPACITIVE LOAD (pF)
100 1000 FREQUENCY (kHz)
10,000
(c) 2006 Microchip Technology Inc.
DS21393C-page 7
TC1426/TC1427/TC1428
TYPICAL CHARACTERISTICS (CONTINUED)
Low-State Output Resistance
15 100 mA 13 50 mA
TA = +25C
High-State Output Resistance
50 42 100 mA
TA = +25C
Crossover Energy Loss
10-8
R OUT ()
ROUT ()
A (sec)
9 11 VDD (V) 13 15
11
34
10-9
9 10 mA 7
26
50 mA
18 10 mA
5 5 7 9 11 VDD (V) 13 15
10 5 7
10-10
4
6
8
10 12 VDD (V)
14
16
18
Quiescent Power Supply Current vs. Supply Voltage
20 BOTH INPUTS LOGIC `0' 20
Quiescent Power Supply Current vs. Supply Voltage
BOTH INPUTS LOGIC `1'
SUPPLY VOLTAGE (V)
15
SUPPLY VOLTAGE (V)
0 50 100 150 200 300
15
10
10
5
5
0 400 SUPPLY CURRENT (A)
0 1 2 3 4 5 6 SUPPLY CURRENT (mA)
Thermal Derating Curves
1600 1400 8 Pin DIP
MAX. POWER (mW)
1200 1000 800 8 Pin SOIC 600 400 200 0 0 10 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (C)
DS21393C-page 8
(c) 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
Pin 1
W
P Standard Reel Component Orientation for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P Standard Reel Component Orientation for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
(c) 2006 Microchip Technology Inc.
DS21393C-page 9
TC1426/TC1427/TC1428
5.3 Package Dimensions
8-Pin Plastic DIP
Pin 1
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
3 Min.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
8-Pin SOIC
Pin 1
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) Typ.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40)
Dimensions: inches (mm)
8 Max.
DS21393C-page 10
(c) 2006 Microchip Technology Inc.
TC1426/TC1427/TC1428
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
(c) 2006 Microchip Technology Inc.
DS21393C-page 11
TC1426/TC1427/TC1428
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Literature Number: DS21393C FAX: (______) _________ - _________
Device: TC1426/TC1427/TC1428 Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21393C-page 12
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21393C-page 13
WORLDWIDE SALES AND SERVICE
AMERICAS
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02/16/06
DS21393C-page 14
(c) 2006 Microchip Technology Inc.

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